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Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging

✍ Scribed by Yongxi Zhang, ; Xiangyang Hu, ; Zhao, J.H.; Kuang Sheng, ; Cannon, W.R.; Xiaohui Wang, ; Fursin, L.

Book ID: 120253221
Publisher: IEEE
Year: 2009
Tongue: English
Weight: 504 KB
Volume: 32
Category: Article
ISSN: 1521-3331
DOI: 10.1109/TCAPT.2009.2029701

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