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Rheological behavior of an epoxy/amine system near the gel point

โœ Scribed by Lairez, D.; Adam, M.; Emery, J. R.; Durand, D.


Book ID
127126648
Publisher
American Chemical Society
Year
1992
Tongue
English
Weight
365 KB
Volume
25
Category
Article
ISSN
0024-9297

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โœ F. Y. C. Boey; W. Qiang ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 218 KB

The DEBGA-MHHPA epoxy system has found increasing applications in microelectronics packaging for which the ability to understand and model the cure kinetics mechanism accurately is crucial. The present article reports on the work done to elucidate accurate knowledge of the gel point by rheological m