Resist removal process in dual damascene structure integrating Cu and SiLK® for 0.18 μm technology

✍ Scribed by D. Louis; C. Arvet; E. Lajoinie; C. Peyne; S. Lee; I. Berry; Q. Han

• Publisher: Elsevier Science
• Year: 2000
• Tongue: English
• Weight: 874 KB
• Volume: 53
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(00)00338-5