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Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

โœ Scribed by Xu Song; Kong Boon Yeap; Jing Zhu; Jonathan Belnoue; Marco Sebastiani; Edoardo Bemporad; Kaiyang Zeng; Alexander M. Korsunsky


Book ID
113937452
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
628 KB
Volume
520
Category
Article
ISSN
0040-6090

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๐Ÿ“œ SIMILAR VOLUMES


Residual stress measurement in thin film
โœ X. Song; K.B. Yeap; J. Zhu; J. Belnoue; M. Sebastiani; E. Bemporad; K.Y. Zeng; A ๐Ÿ“‚ Article ๐Ÿ“… 2011 ๐Ÿ› Elsevier ๐ŸŒ English โš– 703 KB

In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to rec