Residual stress measurement in thin film
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X. Song; K.B. Yeap; J. Zhu; J. Belnoue; M. Sebastiani; E. Bemporad; K.Y. Zeng; A
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Article
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2011
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Elsevier
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English
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In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to rec