Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

✍ Scribed by Chicot, D.; Tilkin, K.; Jankowski, K.; Wymysłowski, A.

• Book ID: 121905465
• Publisher: Elsevier Science
• Year: 2013
• Tongue: English
• Weight: 736 KB
• Volume: 53
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2013.01.008