Relaxation of dislocations in copper
✍ Scribed by P. G. Bordoni; M. Nuovo; L. Verdini
- Book ID
- 112916388
- Publisher
- Società Italiana di Fisica
- Year
- 1960
- Weight
- 22 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0029-6341
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📜 SIMILAR VOLUMES
## Abstract A 300 µm thick tensile specimen of OFHC copper is subjected to a tensile loading sequence and deformed to a maximal strain of 3.11%. Using the novel three‐dimensional X‐ray diffraction method ‘High angular resolution 3DXRD', the evolution of the microstructure within a deeply embedded g
An in-situ annealing experiment has been performed on an intergranular dislocation configuration composed only of glissile grain boundary dislocations observed in a near Σ = 3 {1 1 1} grain boundary in copper. Relaxation phenomena are not obvious than those predicted by theoretical models. Upon anne