Relations between solder dip resistance and moisture permeability of printed circuit adhesives

✍ Scribed by Isamu Namiki

• Publisher: John Wiley and Sons
• Year: 1976
• Tongue: English
• Weight: 339 KB
• Volume: 20
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.1976.070200720

✦ Synopsis

By measuring moisture permeability constants of printed circuit adhesive films having different solder dip resistances, a study was made of the relation between moisture permeability and solder dip resistances. Comparisons of poly(vinylbutyra1) (1)-phenolic resin with I-epoxy resin, I-phenolic resin with poly(viny1 acetate)-phenolic resin, I-phenolic resin with poly(vinylforma1)phenolic resin and study of the effect of hydroxyl group content of I show that adhesive films of good solder dip resistance have small moisture permeability. The solder dip resistance depends markedly on the mole ratio of formaldehyde-phenol in the phenolic resin, while the moisture permeability is almost independent of the ratio.