✦ LIBER ✦

Effect of molecular structure of phenolic resin on solder dip resistance and peel strength of printed circuit adhesives

✍ Scribed by Isamu Namiki

Publisher: John Wiley and Sons
Year: 1976
Tongue: English
Weight: 443 KB
Volume: 20
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.1976.070200320

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