Relation between delamination and temperature cycling induced failures in plastic packaged devices

✍ Scribed by Van Doorselaer, K.; de Zeeuw, K.

• Book ID: 117872776
• Publisher: IEEE
• Year: 1990
• Tongue: English
• Weight: 512 KB
• Volume: 13
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.62533