Relation between delamination and temperature cycling induced failures in plastic packaged devices : Karel Van Doorselaer and Kees De Zeeuw. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 879 (1990)

• Book ID: 103287580
• Publisher: Elsevier Science
• Year: 1991
• Tongue: English
• Weight: 129 KB
• Volume: 31
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(91)90067-h