𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Reduction of strain in high temperature superconductor thin film devices

✍ Scribed by M.I. Faley; S.B. Mi; A. Petraru; C.L. Jia; U. Poppe; K. Urban

Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
189 KB
Volume
460-462
Category
Article
ISSN
0921-4534

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Coupled heat transfer and thermal stress
Coupled heat transfer and thermal stress in high-Tc thin-film superconductor devices
✍ B. Gu; P.E. Phelan; S. Mei πŸ“‚ Article πŸ“… 1998 πŸ› Elsevier Science 🌐 English βš– 322 KB

A coupled heat transfer and thermal stress analysis is developed for a thin-film high-T c superconductor device. The thermal boundary resistance between the film and substrate, which is modelled as a function of interfacial peeling stress, is used to couple the structural and thermal sides of the mo