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Recovery stress and shape memory stability in Ni–Ti–Cu thin wires at high temperatures

✍ Scribed by Molnar, Peter; Van Humbeeck, Jan

Book ID
126887886
Publisher
Carl Hanser Verlag
Year
2011
Tongue
English
Weight
513 KB
Volume
102
Category
Article
ISSN
1862-5282

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Isothermal stress-induced transformations in Cu-13.1Al-4.0Ni (wt.%) single crystal wires were studied up to an overall strain of 8.62% and cycled until stabilization at test temperatures in the range, 25-175 • C, after the material had been heated from room temperature. A total of 26 cycles were nee