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Recent IC assembly technology and reliability Ag paste glue die bonding : Akira Shinohara and Shinji Okamura. Proc. 15th Symp. Reliab. Maintainab. (Union of Japanese Scientists and Engineers, Tokyo), 15 (1985)

Publisher: Elsevier Science
Year: 1987
Tongue: English
Weight: 135 KB
Volume: 27
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(87)90249-6

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