Realization of mechanical decoupling zones for package-stress reduction

✍ Scribed by V.L. Spiering; S. Bouwstra; J.H.J. Fluitman

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 948 KB
• Volume: 37-38
• Category: Article
• ISSN: 0924-4247
• DOI: 10.1016/0924-4247(93)80135-4

✦ Synopsis

The reahzatlon of mechamcal decouphng zones around a membrane to reduce package stresses 1s presented Wet-isotropic etchmg v&h a mtnc/fluondlc solution (HNO,/HF/H,O) as well as restive-Ion etchmg (RIE) wth a sulphurhexafluonde/oxygen (SF,/O,) plasma are mvestlgated to reahze deep nrcular grooves The shape of the cross section of the groove, which determines the shape of the decouphng zone, can be controlled using the RIE method by changmg the etch conchbons It IS shown that a large undercut at low pressures as well as a small undercut at high pressures 1s possible ullth a SF,/02 plasma, leading to round or steep sidewalls of the grooves, respectively Fmally a completed bare structure contammg a membrane and a surroundmg decouphng zone IS presented