𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Pulsed stress reliability investigations of schottky diodes and HBTS

✍ Scribed by M. Schüβler; V. Krozer; K.H. Bock; M. Brandt; L. Vecci; R. Losi; H.L. Hartnagel

Publisher
Elsevier Science
Year
1996
Tongue
English
Weight
305 KB
Volume
36
Category
Article
ISSN
0026-2714

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Reliability investigation and characteri
Reliability investigation and characterization of failure modes in Schottky diodes
✍ Shivarajiv Somisetty; Peter Ersland; Xinxing Yang; Jason Barrett 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 498 KB

Schottky diodes may be realized by various techniques, depending on application and processing technology. M/A-COM has recently developed an enhancement/depletion (E/D) pHEMT process, used primarily for control circuits around its mature RF circuitry. We report here a reliability study of two diodes

Experimental and theoretical investigati
Experimental and theoretical investigation of MEH-ppv based Schottky diodes
✍ Mo Zhu; Tianhong Cui; Kody Varahramyan 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 305 KB

MEH-PPV (poly[2-methoxy-5-(2 0 -ethyl-hexyloxy)-1,4-phenylene vinylene]) based Schottky diodes have been fabricated and investigated through the analyses of current density-voltage and capacitance-voltage characteristics. Temperature-dependent hole mobility of MEH-PPV is extracted by the space-charg

Investigations of SiC merged pin Schottk
Investigations of SiC merged pin Schottky diodes under isothermal and non-isothermal conditions
✍ J. Zarębski; J. Dąbrowski 📂 Article 📅 2011 🏛 John Wiley and Sons 🌐 English ⚖ 249 KB

## Abstract The paper concerns the problem of SPICE modeling of the merged pin Schottky (MPS) diodes. In the paper, the SPICE electrothermal model (ETM) of the SiC MPS diodes proposed by Infineon Technologies is investigated. The model was verified experimentally by comparing the calculated and the