Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

✍ Scribed by J Ferreira; H Seiroco; F Braz Fernandes; R Martins; E Fortunato; A.P Marvão; J.I Martins

• Book ID: 108416308
• Publisher: Elsevier Science
• Year: 2000
• Tongue: English
• Weight: 150 KB
• Volume: 168
• Category: Article
• ISSN: 0169-4332
• DOI: 10.1016/s0169-4332(00)00627-9