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Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

✍ Scribed by J Ferreira; H Seiroco; F Braz Fernandes; R Martins; E Fortunato; A.P Marvão; J.I Martins


Book ID
108416308
Publisher
Elsevier Science
Year
2000
Tongue
English
Weight
150 KB
Volume
168
Category
Article
ISSN
0169-4332

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