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[IEEE 2013 15th European Conference on Power Electronics and Applications (EPE) - Lille, France (2013.09.2-2013.09.6)] 2013 15th European Conference on Power Electronics and Applications (EPE) - Features of wafer — Mo joining by sintering of silver paste for large area silicon devices

✍ Scribed by Chernikov, A. A.; Stavtsev, A. V.; Surma, A. M.

Book ID: 124049788
Publisher: IEEE
Year: 2013
Weight: 428 KB
Category: Article
ISBN: 1479901164
DOI: 10.1109/EPE.2013.6631822

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