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[IEEE 2013 15th European Conference on Power Electronics and Applications (EPE) - Lille, France (2013.09.2-2013.09.6)] 2013 15th European Conference on Power Electronics and Applications (EPE) - Features of wafer — Mo joining by sintering of silver paste for large area silicon devices

✍ Scribed by Chernikov, A. A.; Stavtsev, A. V.; Surma, A. M.


Book ID
124049788
Publisher
IEEE
Year
2013
Weight
428 KB
Category
Article
ISBN
1479901164

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