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Production and sintering properties of molybdenum-alumina composites from coated powders

โœ Scribed by H. Kaga


Book ID
117184850
Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
164 KB
Volume
53
Category
Article
ISSN
0026-0657

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Tungsten layered alumina composite is being extensively used in electronic packaging. In the present work alumina substrate densification and adhesion aspects between substrates and tungsten overlays are investigated. The effects of sintering atmosphere, temperature, lubricant content, metal binders