Co-sintering of tungsten alloy slurry co
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K Biswas; G.S Upadhyaya
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Article
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1998
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Elsevier Science
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Tungsten layered alumina composite is being extensively used in electronic packaging. In the present work alumina substrate densification and adhesion aspects between substrates and tungsten overlays are investigated. The effects of sintering atmosphere, temperature, lubricant content, metal binders