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Co-sintering of tungsten alloy slurry coated alumina composites and their properties

✍ Scribed by K Biswas; G.S Upadhyaya


Publisher
Elsevier Science
Year
1998
Weight
236 KB
Volume
19
Category
Article
ISSN
0261-3069

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✦ Synopsis


Tungsten layered alumina composite is being extensively used in electronic packaging. In the present work alumina substrate densification and adhesion aspects between substrates and tungsten overlays are investigated. The effects of sintering atmosphere, temperature, lubricant content, metal binders treatment and their amount on adhesion behaviour and transverse rupture strength have been reported. SEM studies have also been supplemented to correlate the structure property behaviour.


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