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Processing, microstructure, and properties of co-continuous alumina-aluminum composites

✍ Scribed by M.C. Breslin; J. Ringnalda; L. Xu; M. Fuller; J. Seeger; G.S. Daehn; T. Otani; H.L. Fraser


Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
970 KB
Volume
195
Category
Article
ISSN
0921-5093

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Tungsten layered alumina composite is being extensively used in electronic packaging. In the present work alumina substrate densification and adhesion aspects between substrates and tungsten overlays are investigated. The effects of sintering atmosphere, temperature, lubricant content, metal binders