Process Variation and Temperature-Aware Full Chip Oxide Breakdown Reliability Analysis

✍ Scribed by Cheng Zhuo; Chopra, K.; Sylvester, D.; Blaauw, D.

• Book ID: 117908567
• Publisher: IEEE
• Year: 2011
• Tongue: English
• Weight: 812 KB
• Volume: 30
• Category: Article
• ISSN: 0278-0070
• DOI: 10.1109/tcad.2011.2142183