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Process development for the assembly of microsystems with hot melt adhesives

✍ Scribed by Annika Raatz; Sven Rathmann; Jürgen Hesselbach

Book ID: 113538004
Publisher: International Academy for Production Engineering
Year: 2012
Tongue: English
Weight: 577 KB
Volume: 61
Category: Article
ISSN: 0007-8506
DOI: 10.1016/j.cirp.2012.03.104

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