𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Pressing ceramic components for integrated circuit frames

✍ Scribed by M. I. Timokhova; L. I. Medvedeva


Publisher
Springer US
Year
1991
Tongue
English
Weight
478 KB
Volume
48
Category
Article
ISSN
0361-7610

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


Integrated-circuit-pressed ceramic-packa
✍ Y. P. Zhang 📂 Article 📅 2004 🏛 John Wiley and Sons 🌐 English ⚖ 171 KB

## Abstract A novel integrated‐circuit‐pressed ceramic‐package antenna is proposed for the first time. The antenna is intended for use in the single‐chip solutions of wireless transceivers using deep submicron complementary metal‐oxide semiconductor (CMOS) technology. The prototype antenna printed

Integrated-circuit pressed-ceramic packa
✍ Y. P. Zhang; M. A. Do 📂 Article 📅 2001 🏛 John Wiley and Sons 🌐 English ⚖ 115 KB

## Abstract A novel integrated‐circuit pressed‐ceramic package antenna is proposed for the single‐chip solution of a wireless transceiver. The antenna printed on a dual‐in‐line package is studied experimentally at 2.4 GHz. The results show that the antenna has achieved a bandwidth of 15.7% and a ga