## Abstract A novel integrated‐circuit‐pressed ceramic‐package antenna is proposed for the first time. The antenna is intended for use in the single‐chip solutions of wireless transceivers using deep submicron complementary metal‐oxide semiconductor (CMOS) technology. The prototype antenna printed
✦ LIBER ✦
Pressing ceramic components for integrated circuit frames
✍ Scribed by M. I. Timokhova; L. I. Medvedeva
- Publisher
- Springer US
- Year
- 1991
- Tongue
- English
- Weight
- 478 KB
- Volume
- 48
- Category
- Article
- ISSN
- 0361-7610
No coin nor oath required. For personal study only.
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