Microstructural investigation of electro
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S. Strehle; S. Menzel; H. Wendrock; J. Acker; K. Wetzig
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Article
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2003
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Elsevier Science
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English
β 823 KB
In this article we present microstructural investigations of electrodeposited CuAg-alloy metallization thin films. The deposition was carried out on Si(100) / SiO / Ta / TaN / Cu-seed substrates at room temperature without any additives. It was 2 found that the mean grain size decreases with increas