✦ LIBER ✦

Post etch cleaning of low-k dielectric materials for advanced interconnects: Characterization and process optimization

✍ Scribed by D. Louis; E. Lajoinie; F. Pires; W.M. Lee; D. Holmes

Book ID: 114155821
Publisher: Elsevier Science
Year: 1998
Tongue: English
Weight: 297 KB
Volume: 41-42
Category: Article
ISSN: 0167-9317
DOI: 10.1016/s0167-9317(98)00096-3

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Porosity and structure evolution of a Si

Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process

✍ L. Broussous; W. Puyrenier; D. Rebiscoul; V. Rouessac; A. Ayral 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 195 KB

In the back end of line (BEOL) interconnections for 65 nm and beyond technology nodes, the integration of porous dielectric materials is now needed to improve signal propagation. In order to develop and optimize etching and cleaning process steps that may degrade the dielectric material, the charact

Extraction of effective dielectric const

Extraction of effective dielectric constants and the effect of process damage of low-k dielectrics for advanced interconnects

✍ Y.L. Cheng; Y.L. Wang; H.C. Chen 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 328 KB