## Abstract A polyurethaneβmodified epoxy resin system with potential as an underfill material in electronic packaging and its preparation procedure were studied. The procedure enabled the practical incorporation of an aliphatic polyurethane precursor, synthesized from poly(ethylene glycol) and hex
Polyurethane-modified epoxy resin and their polymer particle filled epoxies
β Scribed by Huei-Hsiung Wang; Jung-Chieh Chen
- Book ID
- 105214717
- Publisher
- Springer
- Year
- 1996
- Tongue
- English
- Weight
- 408 KB
- Volume
- 3
- Category
- Article
- ISSN
- 1022-9760
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Interpenetrating polymer networks (IPNs) were prepared from polyurethane (PU)-modified epoxy with different molecular weight of polyol and polyurethanes based on the mixture of polydiol and polytriol by a one-shot method. Two types of PU-modified epoxy: PU-crosslinked epoxy and PU-dangled epoxy were
An epoxy-terminated organosilicon polymer (denoted as ETOP) was used as modifier to blend with bisphenol A type epoxy resins. For uncured epoxy resins/ETOP blends, the miscibility is mainly the contribution of entropy. The phase boundary was investigated. The turbidity points were determined on the