Polyurethane-modified epoxy resin: Solve
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S. Ong; J. Ismail; M. Abu Bakar; I. A. Rahman; C. S. Sipaut; C. K. Chee
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Article
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2009
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John Wiley and Sons
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English
β 492 KB
π 2 views
## Abstract A polyurethaneβmodified epoxy resin system with potential as an underfill material in electronic packaging and its preparation procedure were studied. The procedure enabled the practical incorporation of an aliphatic polyurethane precursor, synthesized from poly(ethylene glycol) and hex