Deep uv lithography
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Article
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1976
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Elsevier Science
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English
β 145 KB
35 1674. Deep uv lithography. (USA) Using deep uv light ranging from 2000 to 2600 A, submicrometer patterns in photoresist with height-to-width aspect ratios as high as 15 can be achieved. The well known electron-beam positive resist, polymethyl methacrylate (PMMA), is used as the deep uv photoresis