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Platinum wire wedge bonding: A new IC and microsensor interconnect

✍ Scribed by Joseph V. Mantese; William V. Alcini

Book ID: 112812260
Publisher: Springer US
Year: 1988
Tongue: English
Weight: 911 KB
Volume: 17
Category: Article
ISSN: 0361-5235
DOI: 10.1007/bf02652107

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Platinum wire wedge bonding: a new IC an

Platinum wire wedge bonding: a new IC and microsensor interconnect: J V MANTESE, W V ALCINI (Dept. of Electr. & Electron. Eng., General Motors Res. Labs., Warren, MI, USA) J. Electron. Mater. (USA), vol. 17, no. 4, pp. 285–289 (July 1988)

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 104 KB