Platinum wire wedge bonding: a new IC and microsensor interconnect: J V MANTESE, W V ALCINI (Dept. of Electr. & Electron. Eng., General Motors Res. Labs., Warren, MI, USA) J. Electron. Mater. (USA), vol. 17, no. 4, pp. 285–289 (July 1988)

• Book ID: 103269746
• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 104 KB
• Volume: 20
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/0026-2692(89)90013-x