Elastic/plastic fracture analysis for bo
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Shoji E. Yamada
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Article
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1987
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Elsevier Science
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English
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Fracture in a thin elastic/plastic layer bonded by elastic beam-like materials is analytically considered. A direct impetus of this study is to investigate the cracking of a soldered joint commonly seen in electronic systems. A common approach of beam-on-elastic-foundation for bonded joints is exten