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Physical properties of materials: I. Strengths and related properties of metals and wood


Publisher
Elsevier Science
Year
1924
Tongue
English
Weight
48 KB
Volume
198
Category
Article
ISSN
0016-0032

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๐Ÿ“œ SIMILAR VOLUMES


Diluted epoxy adhesives. I. Physical pro
โœ Thomas J. Dearlove ๐Ÿ“‚ Article ๐Ÿ“… 1978 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 632 KB

A series of epoxy adhesives were prepared from a commercial bisphenol A-epichlorohydrin epoxy resin by diluting it with varying amounts of either phenyl glycidyl ether or 1,4-butanediol diglycidyl ether and curing with either diethylenetriamine (DTA) or diethylaminopropylamine (DPA). The initial phy

Modelling moisture-related mechanical pr
โœ I. D. Cave ๐Ÿ“‚ Article ๐Ÿ“… 1978 ๐Ÿ› Springer ๐ŸŒ English โš– 548 KB

By starting with simple concepts of the molecular structure and building up through the various levels of organisation in the wood cell wall it is poss~le to construct a model that simultaneously predicts the variation with moisture content change of both the longitudinal Young's modulus and longitu

Combined effect of boron compounds and h
โœ S. Nami Kartal; Won-Joung Hwang; Yuji Imamura ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 690 KB

This study evaluated the effects of boron impregnation and heat treatment on the chemical and mechanical properties of wood. Sugi (Cryptomeria japonica D. Don) sapwood specimens treated with either boric acid (BA) or di-sodium octoborate tetrahydrate (DOT) solutions were exposed to heat treatments a