PCI Express Card Electromechanical Specification, Revision 3.0

• Publisher: PCI-SIG
• Year: 2013
• Tongue: English
• Leaves: 169
• Category: Library

✦ Table of Contents

1. Introduction
   1.1. Terms and Definitions
   1.2. Reference Documents
   1.3. Specification Contents
   1.4. Objectives
   1.5. Electrical Overview
   1.6. Mechanical Overview
   1.7. 150 W Overview
   1.8. 225 W and 300 W Add-in Card Overview
   1.9. System Power Delivery Requirements
2. Auxiliary Signals
   2.1. Reference Clock
   2.1.1. Low Voltage Swing, Differential Clocks
   2.1.2. Spread Spectrum Clocking (SSC)
   2.1.3. REFCLK AC Specifications
   2.1.4. REFCLK Phase Jitter Specification for 2.5 GT/s Signaling Support
   2.1.5. REFCLK Phase Jitter Specification for 5.0 GT/s Signaling Support
   2.1.6. REFCLK Phase Jitter Specification for 8.0 GT/s Signaling Support
   2.2. PERST# Signal
   2.2.1. Initial Power-Up (G3 to S0)
   2.2.2. Power Management States (S0 to S3/S4 to S0)
   2.2.3. Power Down
   2.3. WAKE# Signal
   2.4. SMBus (Optional)
   2.4.1. Capacitive Load of High-power SMBus Lines
   2.4.2. Minimum Current Sinking Requirements for SMBus Devices
   2.4.3. SMBus “Back Powering” Considerations
   2.4.4. Power-on Reset
   2.5. JTAG Pins (Optional)
   2.6. Auxiliary Signal Parametric Specifications
   2.6.1. DC Specifications
   2.6.2. AC Specifications
3. Hot Insertion and Removal
   3.1. Scope
   3.2. Presence Detect
4. Electrical Requirements
   4.1. Power Supply Requirements
   4.2. Power Consumption
   4.3. Power Budgeting Capability
   4.4. Power Supply Sequencing
   4.5. Power Supply Decoupling
   4.6. Electrical Topologies and Link Definitions
   4.6.1. Topologies
   4.6.2. Link Definition
   4.7. Electrical Budgets
   4.7.1. AC Coupling Capacitors
   4.7.2. Insertion Loss Values (Voltage Transfer Function)
   4.7.3. Jitter Values
   4.7.4. Crosstalk
   4.7.5. Lane-to-Lane Skew
   4.7.6. Transmitter Equalization
   4.7.7. Skew within the Differential Pair
   4.7.8. Differential Data Trace Impedance
   4.7.9. Differential Data Trace Propagation Delay
   4.8. Eye Diagrams at the Add-in Card Interface
   4.8.1. Add-in Card Transmitter Path Compliance Eye Diagram at 2.5 GT/s
   4.8.2. Add-in Card Transmitter Path Compliance Eye Diagrams at 5.0 GT/s
   4.8.3. Add-in Card Transmitter Path Compliance Eye Diagrams at 8.0 GT/s
   4.8.4. Add-in Card Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s
   4.8.5. Add-in Card Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s
   4.8.6. Add-in Card Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s
   4.8.7. System Board Transmitter Path Compliance Eye Diagram at 2.5 GT/s
   4.8.8. System Board Transmitter Path Compliance Eye Diagram at 5.0 GT/s
   4.8.9. System Board Transmitter Path Compliance Eye Diagram at 8.0 GT/s
   4.8.10. System Board Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s
   4.8.11. System Board Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s
   4.8.12. System Board Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s
5. 150 W, 225 W, and 300 W Add-in Card Power
   5.1. 150 W Add-in Card Power-Up Sequencing
   5.2. 225 W and 300 W Add-in Card Power-Up Sequencing
6. Card Connector Specification
   6.1. Connector Pinout
   6.2. Connector Interface Definitions
   6.3. Signal Integrity Requirements and Test Procedures
   6.3.1. Signal Integrity Requirements
   6.3.2. Signal Integrity Requirements and Test Procedures for 2.5 GT/s Support
   6.3.3. Signal Integrity Requirements and Test Procedures for 5.0 GT/s Support
   6.3.3.1 Test Fixture Requirements
   6.3.4. Signal Integrity Requirements and Test Procedures for 8.0 GT/s Support
   6.3.4.1 Test Fixture Requirements
   6.4. Connector Environmental and Other Requirements
   6.4.1. Environmental Requirements
   6.4.2. Mechanical Requirements
   6.4.3. Current Rating Requirement
   6.4.4. Additional Considerations
7. PCI Express 2 x 3 Auxiliary Power Connector Definition
   7.1. 6-Position Power Connector System Performance Requirements
   7.2. 6-Position PCB Header
   7.2.1. 6-Position R/A Thru-Hole PCB Header Assembly
   7.2.2. 6-Position R/A Thru-Hole Header Recommended PCB Footprint
   7.2.3. 6-Position R/A SMT PCB Header Assembly
   7.2.4. R/A SMT Header Recommended PCB Footprint
   7.3. 6-Position Cable Assembly
   7.4. Connector Mating-Unmating Keep-Out Area (Latch Lock Release)
   7.5. 6-Position Power Connector System Pin Assignment
   7.6. Additional Considerations
8. PCI Express 2 x 4 Auxiliary Power Connector Definition
   8.1. 2 x 4 Auxiliary Power Connector Performance Requirements
   8.2. 2 x 4 Receptacle
   8.2.1. Connector Drawing
   8.2.2. PCB Footprint
   8.3. Cable Assembly
   8.4. Connector Mating-Unmating Keep-Out Area (Latch Lock Release)
   8.5. 2 x 4 Auxiliary Power Connector System Pin Assignment
   8.6. Additional Considerations
9. Add-in Card Form Factors and Implementation
   9.1. Add-in Card Form Factors
   9.2. Connector and Add-in Card Locations
   9.3. Card Interoperability
   9.4. 150W-ATX Thermal Management
10. PCI Express 225 W/300 W Add-in Card Thermal and Acoustic Management
    10.1. Inlet Temperature
    10.2. Card Thermal Characterization Procedure
    10.3. Acoustic Management
    10.3.1. Background and Scope
    10.3.2. Card Acoustic Characterization Procedure
    10.3.3. Acoustic Recommendations and Guidelines
    A. Insertion Loss Values (Voltage Transfer Function) (Informational Only)
    B. 8.0 GT/s Test Channels
11. Acknowledgements
    Word Bookmarks
    OLE_LINK3
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