Passivation schemes for copper/polymer thin-film interconnections used in multichip modules

✍ Scribed by Adema, G.M.; Hwang, L.-T.; Rinne, G.A.; Turlik, I.

• Book ID: 114560412
• Publisher: IEEE
• Year: 1993
• Tongue: English
• Weight: 860 KB
• Volume: 16
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.214860