✦ LIBER ✦
Passivation schemes for copper-polymer thin-film interconnections used in multichip modules : Gretchen M. Adema, Lih-Tyng Hwang, Glenn A. Rinne and Iwona Turlik. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 53 (February 1993)
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 104 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0026-2714
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