Parametric study of temperature profiles in chips joined by controlled collapse techniques : S. Oktay, IBM J. Res. Dev. 13, No. 3, May (1969), p. 272

• Publisher: Elsevier Science
• Year: 1970
• Tongue: English
• Weight: 101 KB
• Volume: 9
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(70)90050-8