Palladium seeding on the tantalum-insulated silicon oxide film by plasma immersion ion implantation for the growth of electroless Copper

✍ Scribed by J.H Lin; Y.Y Tsai; S.Y Chiu; T.L Lee; C.M Tsai; P.H Chen; C.C Lin; M.S Feng; C.S Kou; H.C Shih

• Book ID: 114085338
• Publisher: Elsevier Science
• Year: 2000
• Tongue: English
• Weight: 404 KB
• Volume: 377-378
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/s0040-6090(00)01443-7