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Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging Platform

✍ Scribed by Zimmermann, L.; Preve, G.B.; Tekin, T.; Rosin, T.; Landles, K.

Book ID: 114571057
Publisher: IEEE
Year: 2011
Tongue: English
Weight: 897 KB
Volume: 17
Category: Article
ISSN: 1077-260X
DOI: 10.1109/jstqe.2010.2084992

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