This paper describes an integrated-circuit package antenna (ICPA) designed and fabricated using low-temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency-band selection. The measured results show that the prototype ICPA with a size of
β¦ LIBER β¦
Packaging an X-band microwave integrated circuit
β Scribed by Granberry, D.S.; Sterling, C.E.
- Book ID
- 114589365
- Publisher
- IEEE
- Year
- 1968
- Tongue
- English
- Weight
- 362 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0018-9383
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Frequency-band selection for an integrat
β
J. J. Wang; Y. Xue; Y. P. Zhang; K. M. Chua; A. C. W. Lu; Lai L. Wai; C. K. Wong
π
Article
π
2005
π
John Wiley and Sons
π
English
β 129 KB
4750890 Test socket for an integrated ci
β
Milford Dube; PeterE Kuhn; HarryP Yorgensen
π
Article
π
1989
π
Elsevier Science
π
English
β 92 KB
The Planar Circuit--An Approach to Micro
β
Okoshi, T.; Miyoshi, T.
π
Article
π
1972
π
IEEE
π
English
β 652 KB
Gradient-based optimization of packaged
β
Atousa Assadihaghi; StΓ©phane Bila; Dominique Baillargeat; Michel Aubourg; Serge
π
Article
π
2008
π
John Wiley and Sons
π
English
β 143 KB
## Abstract A gradientβbased optimization method is presented for the design of packaged integrated microwave circuits. The method uses a reduced electromagnetic model resulting in a quasiβinstantaneous analysis of the packaged device. A gradientβbased strategy identifying parasitic effects due to
[IEEE 2008 European Microwave Integrated
β
Janssen, Jochem; Hilton, Keith P.; Maclean, Jessica O.; Wallis, David J.; Powell
π
Article
π
2008
π
IEEE
β 172 KB
High-efficiency Ka band microwave monoli
β
Lin, S.-W.; Chiu, H.-C.; Fu, J.S.
π
Article
π
2011
π
The Institution of Engineering and Technology
π
English
β 730 KB