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4750890 Test socket for an integrated circuit package

โœ Scribed by Milford Dube; PeterE Kuhn; HarryP Yorgensen


Publisher
Elsevier Science
Year
1989
Tongue
English
Weight
92 KB
Volume
29
Category
Article
ISSN
0026-2714

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Frequency-band selection for an integrat
โœ J. J. Wang; Y. Xue; Y. P. Zhang; K. M. Chua; A. C. W. Lu; Lai L. Wai; C. K. Wong ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 129 KB

This paper describes an integrated-circuit package antenna (ICPA) designed and fabricated using low-temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency-band selection. The measured results show that the prototype ICPA with a size of