## Abstract This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full‐wave analysis. A novel port configuration is used in finite‐element simulation. Agreement between measurement and
Package for filter design based on MATLAB
✍ Scribed by David Báez-López; David Báez-Villegas; René Alcántara; Juan José Romero; Tomás Escalante
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 304 KB
- Volume
- 9
- Category
- Article
- ISSN
- 1061-3773
No coin nor oath required. For personal study only.
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