Overview of packaging for the IBM Enterprise System/9000 based on the glass-ceramic copper/thin film thermal conduction module

✍ Scribed by Tummala, R.R.; Ahmed, S.

• Book ID: 114560338
• Publisher: IEEE
• Year: 1992
• Tongue: English
• Weight: 553 KB
• Volume: 15
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.159869