Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs

✍ Scribed by Zhong, Z.W.; Tee, T.Y.

• Book ID: 114564958
• Publisher: IEEE
• Year: 2009
• Tongue: English
• Weight: 813 KB
• Volume: 97
• Category: Article
• ISSN: 0018-9219
• DOI: 10.1109/jproc.2008.2007479