Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

✍ Scribed by Tong Yan Tee; Hun Shen Ng; Zhaowei Zhong

• Book ID: 108210612
• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 342 KB
• Volume: 46
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2006.01.010