𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Overload fracture of package solder joints

✍ Scribed by Roman Katchmar


Book ID
108362423
Publisher
Elsevier Science
Year
2000
Tongue
English
Weight
448 KB
Volume
40
Category
Article
ISSN
0026-2714

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Fracture behavior of Cu-cored solder joi
✍ Yunsung Kim; Hyelim Choi; Hyoungjoo Lee; Dongjun Shin; Jeongtak Moon; Heeman Cho πŸ“‚ Article πŸ“… 2011 πŸ› Springer 🌐 English βš– 558 KB