Optimization of heat sink geometries for impingement air-cooling of LSI packages

✍ Scribed by Yoshihiro Kondo; Hitoshi Matsushima; Shigeo Ohashi

• Publisher: John Wiley and Sons
• Year: 1999
• Tongue: English
• Weight: 971 KB
• Volume: 28
• Category: Article
• ISSN: 1099-2871
• DOI: 10.1002/(sici)1523-1496(1999)28:2<138::aid-htj7>3.0.co;2-3

✦ Synopsis

This paper describes the use of our previous studys prediction procedures for calculating thermal resistance and pressure drop. The procedures are used in the optimization of heat sink geometries for impingement air-cooling of LSI packages. Two types of heat sinks are considered: ones with longitudinal fins and ones with pin fins. We optimized the heat sink geometries by evaluating 16 parameters simultaneously. The parameters included fin thickness, spacing, and height. For the longitudinal fins, the optimal fin thicknesses were found to be between 0.12 and 0.15 mm, depending on which of the four types of fans were used. For pin fins, the optimal pin diameters were between 0.39 and 0.40 mm. Under constant pumping power, the optimal thermal resistance of the longitudinal fins was about 60% that of the pin fins. For both types of heat sinks, the optimal thermal resistance for four off-the-shelf fans was only slightly (maximum about 1%) higher than the theoretical optimum for the same pumping power. When manufacturing cost performance is considered, the most economical fin thickness and diameter are about 5 to 10 times higher than the optimal values calculated without respect for manufacturing costs. These values almost correspond to the actual limits of extrusion and press heat-sink manufacturing processes.