Experimental study of impingement cooling by heat sinks with thin longitudinal fins for LSI packages

✍ Scribed by Kondo, Yoshihiro ;Matsushima, Hitoshi ;Komatsu, Toshihiro

• Publisher: John Wiley and Sons
• Year: 1996
• Tongue: English
• Weight: 914 KB
• Volume: 25
• Category: Article
• ISSN: 0096-0802
• DOI: 10.1002/(sici)1520-6556(1996)25:7<449::aid-htj3>3.0.co;2-x