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Optimization of etching parameters of a fluorinated polyimide using the RIBE technique

✍ Scribed by Lucas, Bruno; Moussant, Cyril; Moliton, André; Zyss, Joseph

Publisher
John Wiley and Sons
Year
1998
Tongue
English
Weight
196 KB
Volume
47
Category
Article
ISSN
0959-8103

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✦ Synopsis

A parametric study of etching a new type of Ñuorinated polyimide (6FDA-ODA) has been carried out. This kind of material was especially elaborated for plasma etching (reactive ion etching, RIE) ; its behaviour was tested with the reactive ion beam etching (RIBE) technique which uses an (O) reactive ion beam and allows independent control of the ion energy and current density of the beam. Etch rates were measured as a function of energy (E), current density (J) and incident angle (h) of the beam with the sample normal. These rates were shown to present a maximum value for an energy Ñux (1000 Ó min~1) of about 3 W cm~2 (E \ 6 keV and J \ 0É5 mA cm~2) and decreased when h increased. These results were then compared with etching rates obtained with chemically inert ions (Ar) : in this case, etching rates were Ðve times lower than those measured with O`ions.

Society of Chemical Industry

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