Optimal burn-in decision making

✍ Scribed by Taeho Kim; Way Kuo

• Publisher: John Wiley and Sons
• Year: 1998
• Tongue: English
• Weight: 97 KB
• Volume: 14
• Category: Article
• ISSN: 0748-8017
• DOI: 10.1002/(sici)1099-1638(199811/12)14:6<417::aid-qre220>3.0.co;2-w

✦ Synopsis

This paper presents a conceptual model of burn-in decision making which gives an optimal burn-in time for semiconductor devices and describes how burn-in affects total yield and reliability. For the gate oxide of integrated circuits we consider four burn-in policies: no burn-in, wafer-level burn-in only, package-level burn-in only and wafer-level burn-in prior to package-level burn-in. A decision-making model to minimize cost is given for each burn-in policy. Burn-in time is strongly limited by the cost factor and reliability requirements. In order to reduce the cost incurred in burn-in, a short test time and small test samples are recommended. ©1998 John Wiley & Sons, Ltd.