Optical requirements for projection lithography: W. G. Oldham, S. Subramanian and A. R. Neureuther Solid-State Electron.24 (10), 975 (1981)

• Publisher: Elsevier Science
• Year: 1984
• Tongue: English
• Weight: 97 KB
• Volume: 15
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/s0026-2692(84)80157-3

✦ Synopsis

The pace at which technologies for producing and packaging integrated circuits have advanced has been very rapid over the past few years and shows no signs of slowing down. Examples of the newest innovations include programmable integrated circuits and, more recently still, optical electronics. The authors outline the new techniques which are being developed and how they are affecting both analog and digital telecommunication equipment. Whereas the progress in large scale and very large scale integration has attracted wide interest, packaging technology has frequently not received the attention it deserves, yet it is of significant importance if telecommunication equipment is to meet its performance objectives while remaining cost effective.